Society for Scholarly Publishing Mentorship and Fellowship Programs
In case you missed it, the Society for Scholarly Publishing has two upcoming programs that will be of interest:
SSP Mentorship Program
The SSP Mentorship program connects professionals at all career levels and provides both mentors and mentees opportunities to develop new relationships, share experiences, and learn from others outside their organizations.
Mentors and mentees apply online to participate in a mentorship cohort, or a group of mentors and mentees that begin and end the program during the same timeframe. Each mentorship cohort will last 6 months. The deadline for applications is 16th February.
SSP Fellowship Program
The Career Development Committee of the Society for Scholarly Publishing (SSP) invites applications for the 2018 Annual Fellowship Program. Interested candidates can begin the application process here.
Early-career professionals in the first four years of their employment in the scholarly communications industry and students enrolled in publishing or library and information science programs and are eligible to apply. Applicants need to send their résumés along with responses to three questions posted on the Fellowship program site.
The Fellowship Program offers a wide range of career development and nurturing opportunities for students and early-career professionals in the scholarly publishing industry. SSP will award up to 12 fellowships at the Annual Meeting in Chicago, May 30 – June 1, 2018.
The fellowship provides a year-long program with training opportunities, complimentary SSPmembership, registrations for selected SSP events, and travel reimbursement of up to US $1,300 for domestic applicants and up to $2,000 for those coming from abroad to attend the Annual Meeting.
A notable aspect of the program is the pairing of fellows with a mentor from the publishing and library fields. The mentors and mentees meet via quarterly webinars.
For more information on the program and application process, click here. The deadline to send in applications is Thursday, March 1, 2018.